Views 154 | Created 2024.09.30 | Modified 2024.09.30 | Public Relations Team

·         Students of the Interdisciplinary Major in AI Semiconductor Participate in the ISOCC 2024 Conference in Japan

Students from Interdisciplinary Major in AI Semiconductor participated in the “International System-on-Chip Conference (ISOCC 2024)” held in Japan from August 19 to 22, 2024.

ISOCC is a prestigious global conference that covers the latest technologies and research trends in the field of semiconductor and system-on-chip (SoC) design. It addresses a wide range of topics related to semiconductor design, including the fusion of AI and SoC design technologies, low-power circuit design, and advanced semiconductor processes.

Professor Seung-hoon Koh (Department of Electronic Materials Engineering), who guided the students, remarked, “Through this conference, students were able to participate in various academic activities and engage with global experts. They gained insights into the latest technological trends through numerous academic sessions and exhibitions, fostering both academic growth and practical understanding.”

He added, “This conference also provided a valuable opportunity to discuss research exchange and collaboration strategies between our university and Inha University through a joint forum. I hope that in the future, students will actively participate in conferences and forums, allowing them to experience diverse academic discussions and stay updated on the latest trends in the semiconductor industry.”